진공리플로우 AD

 

 

 

 

 

 

 

 

 

 

 

 

Name	Laboratory Vacuum Reflow Oven
Model	VC 2
Soldering size	200*200mm
Oven size (LxWxH)	900*800*1300mm
Weight	120kgs
Heating Plate	Down heating
Height of Chamber	100mm
Max Temperature	450°C
Heating speed	Fastest can reach to 120°C /min
Cooling speed	≥120℃/min
Lateral temperature difference	±2°C
Gas support	N2/HCOOH
Process support	Solder paste /Preform solder
Furnace load	5KW,bottom heating system
Power standard	380V, 50HZ/60HZ
Current	Max 3 x20 A, 50-60 HZ
Heating plate	Red copper plate with special treatment (Optional: Red copper/Graphite/Graphite with SIC(on surface)
Ultimate vacuum	1 Pa Pump type : Oil pump /Dry pump Ultimate vacuum level :1 pa Working vacuum level :according to the process demand Vacuum leak rate:15hours :0.5-1 Mbar Type of vacuum detector: Helium leak detector Vacuumizing time (from environment atmosphere to Vacuum 1 PA:5-10mins, to 5 Pa 90s.
Control system	Control way	Siemens PLC and Touch screen
	Observation window	1
	Set of temperature curve	Temperature + Time (Can set the temperature and time, also can set the heating gradient, Max can set 150 process period)
	Interface	COM
Optional	Video monitory system	Check and analysis soldering process
		Video recording function, will helpful new product develop and analysis
Safety	Over-temperature alarm of chamber, alarm of periodical heating over-temperature
	System self-inspection function, only under the normal state, program will allow the equipment to run
	Pressure inspect function of cooling-water, Low-pressure alarm,
	One-key cutoff the part heating power