세상은 나의 생각보다 변화가 빠르다.

우리는 매일 새로운 상의 정보를 학습하고 노력하여야 시대의 필요한 사람이 된다.

all reflow 자세히보기

12. Selective Soldering/L. 디핑 솔더링 장비

반 자동 디핑 솔더링 장비 동영상

allreflow 2017. 1. 7. 21:26
728x90

 

 

 

Specifications

 Model

 3530

 PCB Size

 Min 60 mm x 60 mm,Max 350 mm x 300 mm

 Solder Pot Size

 W400mm  x D340mm  x H80mm

 Solder Pot Capacity

 Approx. 70 Kg

 Solder Pot Temperature

 Recommended 285 °C Lead-Free SAC,recommended 265 °C SnPb 450 °C max.

 Solder Dwell Time

 1-10 sec.

 Overall Dimensions

 W600mm  x D750mm x H540mm

 Weight

 80Kgs

 Power Requirements

 220V, Single Phase, 50/60 Hz, 20A, 3.6KW

 Shipping Weight

 Approx. 125 Kg

 

Auto Dip Soldering Machine 3530 Features

 Pin-type, “bed-of-nails” PCB holder for boards from 60 x 60 mm to 350 x 300 mm no special fixturing or

   pallets needed.

 Multiple small boards can be processed simultaneously, provided they fit within the 350 x 300mm area; pin supports allow random

    placement of PCBs and assemblies in loading area.

 Independent, dial-adjustable, speed controls for left and right elevator motors control dipping angle and speed to simulate wave

    soldering.

 Digital timer for setting solder dwell time; typically 3-5 seconds.

 Stainless steel solder pot; holds approx. 70 Kg free SAC; approx. 85 Kg SnPb,Titaniium solder pot is optional

 Digital PID solder pot temperature controller for lead-free SAC or SnPb solders.

 Automatic dross skimmer and collection trough; cycles prior to dip soldering function.

 Multi-day, 24-hr. timer for automatic startup; allows melting of solder and heating to desired solder bath temperature prior to production.

 Foot pedal for hands-free actuation of soldering cycle.

 Optional spray fluxer accessory available.

 

ADS-3530.png