반 자동 디핑 솔더링 장비 동영상

 

 

 

Specifications
Model	3530
PCB Size	Min 60 mm x 60 mm,Max 350 mm x 300 mm
Solder Pot Size	W400mm  x D340mm  x H80mm
Solder Pot Capacity	Approx. 70 Kg
Solder Pot Temperature	Recommended 285 °C Lead-Free SAC,recommended 265 °C SnPb 450 °C max.
Solder Dwell Time	1-10 sec.
Overall Dimensions	W600mm  x D750mm x H540mm
Weight	80Kgs
Power Requirements	220V, Single Phase, 50/60 Hz, 20A, 3.6KW
Shipping Weight	Approx. 125 Kg

Includes

 

Auto Dip Soldering Machine 3530 Features

● Pin-type, “bed-of-nails” PCB holder for boards from 60 x 60 mm to 350 x 300 mm no special fixturing or    pallets needed.

● Multiple small boards can be processed simultaneously, provided they fit within the 350 x 300mm area; pin supports allow random     placement of PCBs and assemblies in loading area.

● Independent, dial-adjustable, speed controls for left and right elevator motors control dipping angle and speed to simulate wave     soldering.

● Digital timer for setting solder dwell time; typically 3-5 seconds.

● Stainless steel solder pot; holds approx. 70 Kg free SAC; approx. 85 Kg SnPb,Titaniium solder pot is optional

● Digital PID solder pot temperature controller for lead-free SAC or SnPb solders.

● Automatic dross skimmer and collection trough; cycles prior to dip soldering function.

● Multi-day, 24-hr. timer for automatic startup; allows melting of solder and heating to desired solder bath temperature prior to production.

● Foot pedal for hands-free actuation of soldering cycle.

● Optional spray fluxer accessory available.