NameLaboratory Vacuum Reflow OvenModelVC 2Soldering size 200*200mmOven size (LxWxH)900*800*1300mmWeight120kgsHeating PlateDown heatingHeight of Chamber100mmMax Temperature450°CHeating speedFastest can reach to 120°C /minCooling speed≥120℃/minLateral temperature difference±2°CGas supportN2/HCOOHProcess supportSolder paste /Preform solderFurnace load5KW,bottom heating systemPower standard380V, 50H..
