자동 소형 마운터 P30 Pick and place machine with 비젼시스템, 디스펜싱 기능

P30_e.pdf

automatic pick and place machine with dispensing head P30           TECHNICAL DATA working area max. 500x480mm Component range from 0201 to 25x25mm ( option 40x40mm ) min pitch 0,4mm components packgage tapes / sticks / trays Components centering non-contact alignment Placement rate up to 1200 cph. Dispensing rate up to 6000 dots/h Feeder capacity max 31 x 8mm - automatic tape feeder+ 40x8mm strips feeder and 2 x (300 x 200mm) - IC-tray with 200 x 300mm PCB size Resolution X / Y - axis - 0,008mm ( linear encoder ) Z - axis : 0,02mm ( linear encoder ) Rotation : 0,01° ( rotation encoder ) Placement accuracy +/- 0,03mm Dimensions and weight 840 x 630 x 430 mm / ca. 95 kg Supply 230V-50Hz -550W / 0,6 MPa - 25l/min KEY FEATURES Precision automatic vision SMT pick & place machine with dispensing head automatic pick & place head automatic dispensing head automatic nozzle changer ( 6 tools ) top camerasystem for automatic fiducial bottom camerasystem for touchless components centering Gerber - and CAD editor ( all CAD-systems) teach-in mode - electronic manipulator smart feeder system - CAN Bus vision inspektion of printing accuracy of solder paste and accuracy of component placement operating system: Windows 7 remote service via internet Graphical user interface Application area suitable for small and medium volume production qualified for pick & place of standard and fine pitch components incl. SOIC, PLCC, BGA , µBGA, CSP, QFN, LED

 

P30_e.pdf

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