Productronica 2015 Munch 전시회.

 

 

 

SMT 생산장비 전시회인 독일 뭰헨의 Productronica Exhibtion에 2015년 출품하는 장비는 매우 치열한

경쟁의 전시회가 되리라 생각한다.  좀더 지능화된 기능 과 첨단 생산을 위한 전시회의 장이 되리라 생각한다.

세계유일의 뭰헨의 생산기자재 전시회 출품할 장비들을 둘러 보자.

 

 

 

 

 

 

 

 

 

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What is new this year at productronica! productronica: World's leading trade fair for electronics development and production. Messe München | November 10 − 13, 2015 Productronica 2015 opens its doors at 9am on Tuesday, November 10th at the Neue Messe, Munich, Germany. According to reports the shows is bulging at the seams this year with 8 halls, virtually booked out. This year, the number of additional events supporting and surrounding the show is bigger than ever. Starting with our Global Technology Awards on Tuesday evening at 6pm in The Forum in Hall B3. The central theme at the show is without doubt, Industry 4.0 and it’s many manifestations. There will be a plethora of presentations and no doubt many machines on the show floor claiming to be “Industry 4.0 ready”. To try and make some sense of this technological revolution and how it applies to electronics manufacturing, Global SMT & Packaging is hosting a Forum debate in Hall A1 on Wednesday from 15:30 – 16:30. Be sure to join our esteemed panel from ASM, Panasonic, Mentor Graphics. Finally, Walt Custer will be proving the latest updates on the health of the industry with daily presentations. For the full program, please visit Productronica Program. We look forward to seeing you among the schnapps and bratwurst this November!   Visit these Global SMT & Packaging customers in their booths for the most update products in the industry! AIM Alpha ASYMTEK AIM Solder will feature their revolutionary M8 No Clean Solder Paste along with their full line of solder assembly materials. AIM’s M8 No Clean Solder Paste will be among the highlighted products. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduces voiding on QFN/BTC components while producing bright shiny solder joints, leaving minimal, high purity residue engineered to be safely left in place. Additionally, AIM will highlight its liquid fluxes, tin/lead and lead-free alloys, including SN100C. Alpha to Showcase its Latest Product Innovations Alpha will present its latest product innovations, including ALPHA® Exactalloy® Preforms which are used to precisely increase the solder volume in solder joints. Exactalloy® Preforms increase the strength of the solder joints enabling them to withstand harsh operating conditions and improve conductivity. They also eliminate the need for wave soldering. In addition, Alpha will showcase products such as ALPHA® CVP-390 solder paste which provides excellent pin testability and consistent fine pitch printing capabilities; ALPHA® Telecore HF-850 no clean cored wire with superior wetting speeds and very low flux splutter, and its advanced range of Stencil Products. Nordson ASYMTEK Launches Systems that take Coating & Jetting to a Whole New Level New for Productronica: ReadiSet™ Jet Cartridges on Latest Generation Jetting Systems Nordson ASYMTEK's new 2-piece ReadiSetJet Cartridge (patent pending) is quickly and easily removed, cleaned, inspected, and re-installed without tools, maximizing equipment utilization and up-time. It's an integrated part of ASYMTEK's latest generation in industry-leading jetting systems, like the NexJet® NJ-8 System, which improve and simplify the dispensing process for fast-paced production environments. With these systems it's as easy as ready, set, and jet. The Select Coat® SL-940 is a premier conformal coating system for both precision and spray coating with new features and process controls that add flexibility. on display: Dual-simultaneous applicators with programmable pitch (60-200mm). A new two-segment conveyor that handles board lengths of 340mm and can be configured pre or post load. Plus, new coating inspection and UV-curing systems. Visitors can try hands-on offline programming of the latest Easy Coat® software. Hall A4 Booth 531 Hall A2 Booth 459 Hall A2 Booth 461 Balver Zinn Glenbrook Indium The Balver Zinn Group going for VOC Emission Reduction with Low-VOC Fluxes The Balver Zinn Group will highlight the company’s extensive range of Cobar’s low-VOC fluxes for VOC emission reduction. Cobar is the inventor of the low-VOC fluxes and world largest supplier of most extensive range of low-VOC fluxes for the electronic industry. Cobar’s latest low-VOC flux technology delivers excellent soldering performance and provides the right solution for increasingly stringent demand of the nowadays lead-free soldering process such as low flux spreading for selective soldering and higher polarity. Also on display will be Cobar OT2M rosin based halogen and halide free solder paste and the unique and highly respected lead-free solder Balver Zinn SN100C® product range. Balver Zinn and Cobar offer solder bar, solder wire, solder flux, gel flux, cleaner, solder paste and miscellaneous soldering products. For more information about the company’s complete range of solder materials, please visit www.balverzinn.com or www.cobar.com Making a Difference with Their Micro-Fluoroscopy Technology Glenbrook Technologies is making a difference with their micro-fluoroscopy technology in pushing the boundaries of research into dysphagia and training surgeons to perform cochlear implants. The University of Missouri School of Medicine research laboratory utilizes a unique system employing, high-resolution micro-fluoroscopy technology, developed and patented by Glenbrook Technologies, which enables researchers to view the swallowing functions in mice while eating and drinking. This is the first time such real-time images have been viewed with x-ray technology. That same technology is now being used at NYU Medical School to train surgeons in performing Cochlear implants in explanted human temporal bone. Cochlear implants, have transformed the lives of many people. Indium Corporation Features Void-Reducing Solder Paste Indium8.9HF Indium Corporation will feature void-reducing Indium8.9HF, a halogen-free, no-clean solder paste. Indium8.9HF is specifically formulated to reduce voiding, while delivering high transfer efficiency with low variability. In addition to outstanding print transfer and excellent response-to-pause, this no-clean solder paste also provides excellent pin-in-paste solderability and hole-fill, while remaining stable at room temperature for up to 30 days. Indium8.9HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology. This solder paste delivers robust reflow capability from a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes potential defects. Hall A4 Booth 261 Hall A3 Booth 314 Hall A4 Booth 214 Landrex Microcare MIRTEC Landrex Technologies releases fully automated Robotic Test Cell  Landrex Technologies will exhibit the NEW Product Introductions the latest development of a jointly developed fully automated Robotic Test Cell using a Precise Automation PF 400 Collaborative Scara Robot coupled to an Omni Engineering Full Functional Rack Mount Tester and Fixture.  With Collaborative Robots taking their place on the production floor replacing operators is now a reality as this Robotic Test Cell can sense its environment will stop operation if obstructed and most importantly it does not need any guarding or additional safety measures.  Additionally, Landrex will be exhibiting a fully automated First Article Inspection System to verify mounting defects and faults on line changes and pilot runs.  The system incorporates automated impedance measurement on chip resistors and capacitors down to 01005 devices.  It also employs a visual inspection module using a CCD camera that automatically displays mounting status of every component. Simple to program, easy to use and increased efficiency on your production floor.      Tergo™ High Performance Flux Remover for Vapour Degreasing The MicroCare® Tergo™ High Performance Flux Remover is a non-flammable, low-temperature cleaning fluid that features a non-volatile additive specifically engineered to clean challenging solder pastes and flux residues. It also can remove stubborn white residues. It is a versatile cleaner that is effective even on water-soluble (OA) fluxes. It has secondary applications as a degreaser and can even remove slight oxidation and tarnish from finished surfaces. The Tergo™ High Performance Flux Remover is compatible with traditional vapour degreasing procedures and no hardware modifications normally are required. This makes the Tergo™ High Performance Flux Remover a drop-in replacement for many older vapour degreasing chemistries that are being phased-out under environmental, health, safety or economic pressures. MIRTEC to exhibit the new MV-6 OMNI MIRTEC will premier the technologically advanced MV-6 OMNI 3D. The new high-speed, high-performance 3D AOI machine boasts 15 mega pixel CoaXPress camera technology, as well as advanced eight phase color lighting system. The machine includes a ten micron/pixel prevision telecentric compound lens design, integrated ten mega pixel side-viewer camera system, and a precision closed loop AC servo drive motor system. Also on display will be Mirtec’s flagship, the MV-9 AOI system, which achieves the highest productivity and ultimate inspection performance, falls calls will be avoided. For the 3D measurement the MV-9 system is working with the “Shadow Free” Moiré Phase Shift image processing. Additionally it is equipped with the 6 Phase colour lighting system for an optimized recognition of lifted leads. At the show, the MV-9 will be linked to a YXLON Cheetah with SmartLoop. Hall A1 Booth 558 Hall A4 Booth 101 Hall A2 Booth 139 Mycronic PK Metals Seho Mycronic 4.0 to be launched In response to the SMT industry’s urgent need to counter the ongoing productivity decline caused by increasing complexity, Mycronic launches its manufacturing concept Mycronic 4.0 – a highly automated, intelligent factory for just-in-time. Today’s electronics industry faces a harsh reality – last-minute customer requests, stock accuracy issues and more and more changeovers together with an increasing number of NPIs. The industry has recently elevated the attention and concern regarding the decline in productivity. Initiatives like Industry 4.0 and Smart Factory are high on the agenda in many companies. Mycronic’s response to these companies’ growing concern, and the SMT industry’s need for higher productivity, is Mycronic 4.0. The full Mycronic 4.0 concept will be on display – an intelligent factory enabling full visibility planning, complete material tracking, efficient changeovers, automated replenishment and intelligent storage solutions. Mycronic 4.0 is a complete, agile manufacturing solution that masters the complexity of modern electronics production. PKAY Metal has received yet one more patent allowance for its revolutionary MS2® Dross Elimination Technology. The latest patent to be allowed is in Korea. This latest adds to the growing portfolio of patents allowed globally for MS2. Dan Feinberg, Vice President for the MS2 group noted “The combination of additional patents allowed for MS2 as well as the new offline method of use in conjunction with the new DOFFS offline equipment is greatly adding to the global acceptance of this process and recognition of the very significant cost saving realized by our global customers” Additional information on the offline method, the DOFFS equipment as well as MS2 can be see by going to www.pkaymetal.com or by contacting sales@pkaymetal.com Get the Spirit of Tomorrow: SEHO Will Introduce Zero-Defect Production SEHO Systems GmbH will highlight zero-fault production. Innovative solutions and custom-made automation technology demonstrate SEHO’s future viability. The zero-fault production line from SEHO is designed for selective soldering of through-hole components, free from defects and completely traced. Besides the selective mini-wave soldering process, this production line incorporates automated optical inspection (AOI) of the solder joints, a verify workstation for verification and classification of detected faults as well as a defined and automated rework soldering process according to the respective soldering defect. Intelligent handling units automatically allocate the assemblies to the next work station. Hall A3 Booth 341 HALL A2 Booth 255 HALL A3 Booth 215 HALL B1 Booth 255 Hall A4 Booth 578 Speedline Stockmeier Super Dry - Totech ITW Electronics Assembly Equipment Group to Showcase New and Leading Productivity Solutions Members of the ITW Electronics Assembly Equipment Group (Illinois Tool Works, Inc. (NYSE: ITW) will be showcasing new technologies and productivity solutions. Members of the group exhibiting include Speedline Technologies and Vitronics Soltec, with best-in-class brands MPM, Camalot, and Electrovert under the Speedline banner. Other ITW companies exhibiting in the booth will include Kester, Chemtronics and TechSpray. The exhibit will include the following: MPM Momentum® BTB, Electrovert OmniMax™, Electrovert Aquastorm 50 Batch Cleaning System. The ITW Electronics Assembly Equipment Group (Illinois Tool Works, Inc. (NYSE: ITW) brings together world-leading brands of electronics assembly equipment including MPM, Camalot, Electrovert, Vitronics Soltec, and Despatch. Stockmeier Urethanes GmbH offer FREE Technical advice on potting and encapsulation of PCB Stockmeier Urethanes GmbH will be offering free technical advice on any issue concerning the potting and encapsulation of PCB or electrical assemblies. Stockmeier Urethanes are fielding a world class industry recognized team, from its electronic and electrical products range Stobicast ®, to give visitors rapid answers and solutions. Our experts have a huge wealth of experience to share and can provide you quickly with the information you need to either begin a new project or to make an existing one better. Stockmeier Urethanes GmbH will also be showcasing new potting and encapsulation technologies featuring the latest in Polyurethane advances for medium to high volume production including UL listed systems with RTI to 1300 C, low hardness and elastic systems, high glass transition and high thermal conductivity. Stobicast® Polyurethane Potting Compounds are proven to be an ideal insulation material for the industrial production of electronic and electrical assemblies. They are suitable for a wide range of applications such as LED drivers, LED Bulbs, PCB / SMT potting, transformers, capacitors, electromagnetic interference filters, sensors, cable couplers, and many other products. Super Dry Launches Full Scale Automated Moisture Management Management Moisture specialist Super Dry has launched a new generation of robotically automated material handling that incorporates complete moisture management, floor life reset and traceability of MSL components. Super Dry® robotically controlled Dry Storage Management Systems are integrated safe storage and drying environments with Zero operator material handling. Incorporating mature, proven MSD technology and wide ranging WMS-System integration capabilities, Super Dry Tower is capable of automatically managing tens of thousands of reels and trays and is totally modular for different size & storage requirements. All relevant data for processing components is managed on a data base, from robotic entry through storage or floor life reset, retrieval and delivery of specified components for production to one or more different assembly locations. Learn more at www.superdry-totech.eu..com Hall A4 Booth 554 Hall A4 Booth 300 Hall A2 Booth 170 Transition Automation Viscom Yamaha Universal Permalex Holder Design Update Transition Automation, Inc., announces a new design upgrade to the Universal Permalex Holder System. The original patented holder design is now enhanced with three improvements: First, the support shim which is commonly included is now eliminated – which maintains the holder and blade assembly in better condition after extended use. The elimination of this extra part makes blade changes easier, and make the squeegee and holder perform more consistently over long duration production runs. A second enhancement is that the holder has been extended to provide more support to the blade – thereby increasing performance and rigidity for large area printing. Large area printing is becoming more common as electronics manufacturers try to maximize machine and line utilization. This stronger squeegee holder enables better printing performance for large area printing operations – by eliminating flex and providing more support for faster printing operations. Finally – the new universal holder includes a spring loaded clamp bar, which extends open when loosened. By opening up – the holder gives the user a clear open area to insert the new blade which improves process repeatability. This new product is in stock in four standard colors: Blue, Silver, Red and Green and is available for delivery in 3-5 days A.R.O. The Permalex Universal Holder System is a widely used precision holder that may be installed on any SMT printer. The holder system is lightweight and includes sliding and floating paste retainers to increase SMT printer performance by keeping the solder paste neatly contained withing the print area.   Viscom Unveils All New AXI System Viscom will present a full line of SPI, AOI and AXI systems. For the first time, Viscom will introduce the new X7058 3D AXI for 100% top and bottom side inspection. The X7058 was specially developed for an ultra-fast, in-line-capable automatic 3D X-ray inspection of electronic assemblies, and will be of particular interest for EMS companies. With this system, the entire electronic assembly is 100 percent 3D-inspected. With the introduction of the X7058, Viscom presents a completely new development in the area of in-line-capable X-ray inspection. Viscom will also introduce the latest generation of inspection systems, including the S3088 SPI, a 3D-SPI with process control, quality uplink, and DualView, as well as the S3088 ultra, a high-speed 3D AOI. Also on display will be the S6056 High-end 3D AOI with dual track transport for more throughput, the X7056RS 3D X-ray inspection with flat panel detectors and combined 3D AOI, the X8011PCB f lexible X-ray inspection for SMT/electronics with quality uplink, the S6053BO AOI for reliable wire bond control, and the S3088 CCI-AOI for conformal coating inspection – now also with plasma coating and wet inspection. Yamaha to Unveil Innovations Boosting Productivity and Quality Yamaha Motor Intelligent Machines’ will spotlight solutions to boost surface-mount productivity and quality, including game-changing AOI, innovative new feeders, and the latest print, placement and inspection platforms in Yamaha’s connected full-line solution. In addition, Yamaha will bring technologies from its robotics division for the first time, unleashing the power of programmable automation and Industry 4.0 in electronics assembly. Launching at the show, new 3D and 2D 5Mpixel optical inspection systems have a wide field of view and make Yamaha's class-leading AOI more affordable than ever, while delivering ease of use, high speed and accuracy. As with the successful 12Mpixel 3D YSi-V system, the new configurations feature Yamaha’s ingenious multi-angle inspection that sees details other systems can miss, as well as laser height and coplanarity measurement to pinpoint problems with leads or underside terminations. Also making its public debut is Yamaha’s latest feeder Automatic Loading Feeder, which banishes the time-consuming task of peeling back cover tape when loading a new component reel. This not only enables faster and easier reel changes, but also eliminates dust and static-electric effects thereby ensuring components remain correctly oriented in the tape. Hall 3 Booth 112/2 Hall A2 Booth 177 Hall A3 Booth 323   Please make sure you visit these other Global SMT & Packaging customers: Aleader Asys Dage Hall A2 Booth 244 Hall A3 Booth 277 Hall A2 Booth 361 DCT Czech Inventec Juki Hall A2 Booth 540 Hall A4 Booth 271 Hall A3 Booth 141 KIC Kulicke & Soffa Panasonic Hall A2 Booth 371 Hall A2 Booth 339 Hall A3 Booth 177 Saki SMT Werthiem SMART Group Hall A2 Booth 239 Hall A4 Booth 155 Hall A4 Booth 506 Mailing Address Trafalgar Publications Ltd. Global SMT & Packaging Crown House, 72 Hammersmith Rd Hammersmith, London, W14 8TH, UK Tel: +44 (0) 207 559 1467 Fax: +44 (0) 207 559 1468 E-mail: news@globalsmt.net Website: www.globalsmt.net Sales Contacts Europe Trevor Galbraith Tel: +1 (239) 245 9264 ext. 101 UK Mobile: +44 (0)7584 072926 US Cell: +1 (239) 287 5401 German Handy: +49 (0)1573 278 4316 tgalbraith@trafalgarmedia.com Americas, Southeast Asia–India, Singapore, Korea & Malaysia Sandy Daneau Tel: +1 (239) 234-1600 Skype: sdaneau.1 sdaneau@trafalgarmedia.com China, Hong Kong, Japan & Taiwan Paul Chen Office: +86 2154049130 pauljc7777@hotmail.com