|
301 Batch Reflow Oven Specification | ||
|
1 |
Solder type |
Lead Free (SNPb) |
|
2 |
Heater Method |
IR & Forced Hot Air Convection |
|
4 |
User Interface |
Android Software Platform Ultra High Resolution Touch Panel WiFi & Networking |
|
5 |
Work Area |
250 x 200mm |
|
6 |
Temperature Rage |
310’C |
|
7 |
Temperature Precision |
+.- 2 C’ |
|
8 |
Temperature Control |
PID Control, SSR |
|
9 |
Warm up time |
Approx 3min |
|
10 |
Power |
3.6Kw (avg) 6.2KW(Max) |
|
11 |
Voltage |
220V Single Phase 50/60Hz |
|
12 |
Exhaust Requirement |
6.3L/Min |
|
13 |
Dimension (L.W.H) |
690mm x 480mm x 280mm |
|
14 |
Weight |
45Kg |
301 profilable batch reflow soldering system includes : • Bench top oven measuring 690(L) x 480(W) x 280 mm(H) • Front-loading heating chamber with working area of 250 x 200 mm • Viewing window in front panel of heating chamber for visual inspection of reflow • Combination infrared and forced-hot-Air convection heating. • Microprocessor-controlled, multi-channel temperature control with ±2°C accuracy • Android software platform and ultra-high-resolution touch screen display • Programmable time and temperature for preheat, soak, reflow, and cooling • Temperature control via heater zone thermocouple or on-board thermocouple • Built-in, integrated WiFi for data transfer and networking • 1 year parts warranty
Shipping Information : (장비 운송 제원) • Packed in wooden crates. Requires handling by motor freight. • Dimensions : 820mm L x 690mm W x 650mm H) • Net Weight : approx. 45 Kg • Gross Weight : 80 Kgs.
ANDROID환경에서 사용 WLAN을 통하여 Data 전송 가능
간단한 운영 방법
Android
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