200C Desk top reflow Small Oven . NamA Since 1988
Better results than you'd ever expect from a batch oven
A combination of quartz infrared and hot air convection, managed by PID intelligent temperature control, ensures consistent, high-quality soldering results-better than you would expect from a single-chamber batch oven. In fact, BT300CP provides excellent results even when 0201s, CSPs, BGAs and fine-pitch QFPs are included in the mix.
Real-time thermal profiling
200C+ includes a thermocouple connection to allow the system to display & record actual PCB temperature data. Process data can be saved and/or printed.
The included laptop computer also makes setting profiles fast and easy. The resulting process data can be saved and/or printed. An unlimited number of profiles can be created and stored as well.
Mimic manufacturer-recommended temperature profiles
Up to forty sequential temperature setpoints can be specified per profile, allowing the BT300CP to reflow with a profile curve similar to a production reflow oven. Solder paste manufacturers' recommended profiles can quickly be recreated.
A nitrogen-compatible version, 200C is also available.
Features
- Attach a thermocouple to the PCB being processed to view, save and print hard copies of real-time thermal profiling data.
- Reproduce solder paste manufacture recommended profiling curves by specifying up to 40 sequential temperature setpoints.
- Analyze temperature graphs post-reflow with point-and-click temperature comparison.
- Create and store a full library of profiles.
- Sample leaded and lead-free solder profiles included.
- Suitable for leaded and lead-free solders.
- PCB holder measures 230 mm x 370 mm.
- Soldering time is approx. 6 minutes (dependant on paste), plus cool-down.
- Quick heat-up: three minute warm-up time.
- Simple programming: set temperatures according to the solder paste's recommended profile.
- Easy operation: place the PCB on the holder, close the drawer, press RUN.
- PID temperature controls for ±2°C accuracy.
- Computer-controlled; laptop and software included.
- Comprehensive spare parts kit included.
- Nitrogen model available
 | Simulate Inline Reflow
Divide a single processing cycle into as many as 40 time/temperature control segments to create a smooth curve that matches the solder paste manufacturer's recommendations and simulates the environment that a PCB assembly is exposed to in an in-line reflow system. An added benefit of this level of control it that is allows for a smooth transition from prototyping and development work to higher volume production. |
 | Real-Time Temperature Monitoring and Data Acquisition
real-time curve of either oven or board temperatures is created and displayed during the process cycle. Actual values are easily compared to set values, allowing for precise parameter adjustment. Process data can be saved and printed for training, development and quality control purposes. |
| A Simple Solution for Your Low Volume Lead-Free Reflow Needs
The BT300CP features a front-load heating chamber with a sturdy pull-out drawer and table size of 9.45" x 11.02" (240 mm x 280 mm). A tempered glass window allows the user to view the reflow process. |
 | Infrared and Forced Convection Combine for Efficient Lead-Free Reflow
Tubular quartz infrared heaters and an internal air circulation system provide a combination of IR and forced hot air convection heating that is ideal for fast, efficient, and uniform batch reflow soldering. All system components are easily accessible for cleaning and maintenance. |
 | Compact Design Ideal for Labs, Schools, Low-Volume Job Shops
The compact design and construction of the BT300CP allows bench-top operation in tight quarters where space is at a premium. At a weight of only 45 kg (approx. 100 lbs.) and a footprint of only 1/3 of a square meter (3.5 sq. ft.) the BT300CP can be installed virtually anywhere. |
| Comprehensive Spare Parts Kit Included
Spare parts kit included, with 3 extra IR heaters, 2 extra circulation motors, software, communication cable and adaptor. |
| Batch Reflow Oven - Specifications |
|---|
| Applicable Solder Types | Lead-Free and Leaded |
| Table Size | 230 mm x 370 mm |
| Heating Method | Quartz IR & Forced Hot Air Convection |
| Temperature Range | Ambient - 300 °C |
| Temperature Control Method | PID Control; ±2% SSR |
| Temp Control Setting | 20-40 Time/Temperature Segments per Profile |
| Warm-up Time | approx. 2 min. |
| Exhaust Requirement | 6.3 L/Min., .22 CFM |
| PC Interface | Laptop Included w/ Control Software |
| Electrical | 220 V, Single Phase, 50/60 Hz, 15A |
| Power | 1.7 KW; 4.1 KW (max.) |
| Dimensions | 26.38" L x 21.26" W x 11.81" H
(670 mm L x 540 mm W x 300 mm H) |
| Weight | approx. (45 Kg)
|
| Simulate Inline Reflow
Divide a single processing cycle into as many as 40 time/temperature control segments to create a smooth curve that matches the solder paste manufacturer's recommendations and simulates the environment that a PCB assembly is exposed to in an in-line reflow system. An added benefit of this level of control it that is allows for a smooth transition from prototyping and development work to higher volume production. |
| Real-Time Temperature Monitoring and Data Acquisition
real-time curve of either oven or board temperatures is created and displayed during the process cycle. Actual values are easily compared to set values, allowing for precise parameter adjustment. Process data can be saved and printed for training, development and quality control purposes. |
| A Simple Solution for Your Low Volume Lead-Free Reflow Needs
The BT300CP features a front-load heating chamber with a sturdy pull-out drawer and table size of 9.45" x 11.02" (240 mm x 280 mm). A tempered glass window allows the user to view the reflow process. |
| Infrared and Forced Convection Combine for Efficient Lead-Free Reflow
Tubular quartz infrared heaters and an internal air circulation system provide a combination of IR and forced hot air convection heating that is ideal for fast, efficient, and uniform batch reflow soldering. All system components are easily accessible for cleaning and maintenance. |
| Compact Design Ideal for Labs, Schools, Low-Volume Job Shops
The compact design and construction of the BT300CP allows bench-top operation in tight quarters where space is at a premium. At a weight of only 45 kg (approx. 100 lbs.) and a footprint of only 1/3 of a square meter (3.5 sq. ft.) the BT300CP can be installed virtually anywhere. |
| Comprehensive Spare Parts Kit Included
Spare parts kit included, with 3 extra IR heaters, 2 extra circulation motors, software, communication cable and adaptor. |
Batch Reflow Oven - Specifications |
|---|
| Applicable Solder Types | Lead-Free and Leaded |
| Table Size | 9.05" x 14.57" (230 mm x 370 mm) |
| Heating Method | Quartz IR & Forced Hot Air Convection |
| Temperature Range | Ambient - 300 °C |
| Temperature Control Method | PID Control; ±2% SSR |
| Temp Control Setting | 20-40 Time/Temperature Segments per Profile |
| Warm-up Time | approx. 2 min. |
| Exhaust Requirement | 6.3 L/Min., .22 CFM |
| PC Interface | Laptop Included w/ Control Software |
| Electrical | 220 V, Single Phase, 50/60 Hz, 15A |
| Power | 1.7 KW; 4.1 KW (max.) |
| Dimensions | 26.38" L x 21.26" W x 11.81" H
(670 mm L x 540 mm W x 300 mm H) |
| Weight | approx. 100 lbs. (45 Kg)
|
200C lead-free batch reflow soldering system includes:
- Benchtop oven measuring 670 x 540 x 300 mm LxWxH
- Energy-efficientquartz infrared and forced-hot-air convection heating with low-turbulence airflow design
- PID temperature controls for ±2˚C accuracy
- Viewing window for visual inspection of reflow
- Cooling fans
- Laptop
- Control software for recording, saving and printing real-time process data and parameter settings
- Comprehensive spare parts kit
- 1 year parts warranty
Shipping Information:
- Packed in wooden crates. Requires handling by motor freight.
- Dimensions: 820mm L x 690mm W x 650mm H
- Gross Weight: 80 kg
Mimic manufacturer-recommended temperature profiles
Up to forty sequential temperature setpoints can be specified per profile, allowing the 200C+ to reflow with a profile curve similar to a production reflow oven. Solder paste manufacturers' recommended profiles can quickly be recreated.
A nitrogen-compatible version, 200C+ is also available.
Features
- Attach a thermocouple to the PCB being processed to view, save and print hard copies of real-time thermal profiling data.
- Reproduce solder paste manufacture recommended profiling curves by specifying up to 40 sequential temperature setpoints.
- Analyze temperature graphs post-reflow with point-and-click temperature comparison.
- Create and store a full library of profiles.
- Sample leaded and lead-free solder profiles included.
- Suitable for leaded and lead-free solders.
- PCB holder measures 230 mm x 370 mm).
- Soldering time is approx. 6 minutes (dependant on paste), plus cool-down.
- Quick heat-up: three minute warm-up time.
- Simple programming: set temperatures according to the solder paste's recommended profile.
- Easy operation: place the PCB on the holder, close the drawer, press RUN.
- PID temperature controls for ±2°C accuracy.
- Computer-controlled; laptop and software included.
- Comprehensive spare parts kit included.
- Nitrogen model available 200N
| Batch Reflow Oven - Specifications |
|---|
| Applicable Solder Types | Lead-Free and Leaded |
| Table Size | 9.05" x 14.57" (230 mm x 370 mm) |
| Heating Method | Quartz IR & Forced Hot Air Convection |
| Temperature Range | Ambient - 300 °C |
| Temperature Control Method | PID Control; ±2% SSR |
| Temp Control Setting | 20-40 Time/Temperature Segments per Profile |
| Warm-up Time | approx. 2 min. |
| Exhaust Requirement | 6.3 L/Min., .22 CFM |
| PC Interface | Laptop Included w/ Control Software |
| Electrical | 220 V, Single Phase, 50/60 Hz, 15A |
| Power | 1.7 KW; 4.1 KW (max.) |
| Dimensions | 670 mm L x 540 mm W x 300 mm H |
| Weight | approx. 100 lbs. (45 Kg) |
lead-free batch reflow soldering system includes:
- Benchtop oven measuring 670 x 540 x 300 mm LxWxH
- Energy-efficientquartz infrared and forced-hot-air convection heating with low-turbulence airflow design
- PID temperature controls for ±2˚C accuracy
- Viewing window for visual inspection of reflow
- Cooling fans
- Laptop
- Control software for recording, saving and printing real-time process data and parameter settings
- Comprehensive spare parts kit
- 1 year parts warranty
Shipping Information:
- Packed in wooden crates. Requires handling by motor freight.
- Dimensions: 820mm L x 690mm W x 650mm H
- Gross Weight: 80 kgs