탁상용 Smart Reflow 안드로이드 환경 인터넷 가능

 

 

 

 

 

301 Batch Reflow Oven Specification
1	Solder type	Lead Free (SNPb)
2	Heater Method	IR & Forced Hot Air Convection
4	User Interface	Android Software Platform Ultra High Resolution Touch Panel WiFi & Networking
5	Work Area	250 x 200mm
6	Temperature Rage	310’C
7	Temperature Precision	+.- 2 C’
8	Temperature Control	PID Control, SSR
9	Warm up time	Approx 3min
10	Power	3.6Kw (avg) 6.2KW(Max)
11	Voltage	220V Single Phase 50/60Hz
12	Exhaust Requirement	6.3L/Min
13	Dimension (L.W.H)	690mm x 480mm x 280mm
14	Weight	45Kg

 

 

 

301 profilable batch reflow soldering system includes :

• Bench top oven measuring 690(L) x 480(W) x 280 mm(H)

• Front-loading heating chamber with working area of 250 x 200 mm

• Viewing window in front panel of heating chamber for visual inspection of reflow

• Combination infrared and forced-hot-Air convection heating.

• Microprocessor-controlled, multi-channel temperature control with ±2°C accuracy

• Android software platform and ultra-high-resolution touch screen display

• Programmable time and temperature for preheat, soak, reflow, and cooling

• Temperature control via heater zone thermocouple or on-board thermocouple

• Built-in, integrated WiFi for data transfer and networking

• 1 year parts warranty

Shipping Information : (장비 운송 제원)

• Packed in wooden crates. Requires handling by motor freight.

• Dimensions : 820mm L x 690mm W x 650mm H)

• Net Weight : approx. 45 Kg

• Gross Weight : 80 Kgs.

 

 

 

 

 

 

 

ANDROID환경에서 사용  WLAN을 통하여 Data 전송 가능

 

간단한 운영 방법

 

Android